Maintainers.txt 13 KB

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  1. EDK II Platforms Maintainers
  2. ============================
  3. This file provides information about the primary maintainers for
  4. EDK II Platforms.
  5. In general, you should not privately email the maintainer. You should
  6. email the edk2-devel list, and Cc the package maintainers and
  7. reviewers.
  8. If the package maintainer wants to hand over the role to other people,
  9. the package maintainer should send the patch to update Maintainers.txt
  10. with new maintainer, and the new maintainer should follow up with
  11. an Acked-by or a Reviewed-by.
  12. Descriptions of section entries:
  13. L: Mailing list that is relevant to this area (default is edk2-devel)
  14. Patches and questions should be sent to the email list.
  15. M: Package Maintainer: Cc address for patches and questions. Responsible
  16. for reviewing and pushing package changes to source control.
  17. R: Package Reviewer: Cc address for patches and questions. Reviewers help
  18. maintainers review code, but don't have push access. A designated Package
  19. Reviewer is reasonably familiar with the Package (or some modules
  20. thereof), and/or provides testing or regression testing for the Package
  21. (or some modules thereof), in certain platforms and environments.
  22. W: Web-page with status/info
  23. T: SCM tree type and location. Type is one of: git, svn.
  24. S: Status, one of the following:
  25. Supported: Someone is actually paid to look after this.
  26. Maintained: Someone actually looks after it.
  27. Odd Fixes: It has a maintainer but they don't have time to do
  28. much other than throw the odd patch in. See below.
  29. Orphan: No current maintainer [but maybe you could take the
  30. role as you write your new code].
  31. Obsolete: Old code. Something tagged obsolete generally means
  32. it has been replaced by a better system and you
  33. should be using that.
  34. F: Files and directories with wildcard patterns.
  35. A trailing slash includes all files and subdirectory files.
  36. F: MdeModulePkg/ all files in and below MdeModulePkg
  37. F: MdeModulePkg/* all files in MdeModulePkg, but not below
  38. F: */Pci/* all files in a directory called Pci, at any depth in
  39. the hierarchy, but not below
  40. One pattern per line. Multiple F: lines per section acceptable.
  41. X: Files and directories that are NOT maintained, same rules as F:
  42. Files exclusions are tested after file matches.
  43. Can be useful for excluding a specific subdirectory, for instance:
  44. F: NetworkPkg/
  45. X: NetworkPkg/Ip6Dxe/
  46. matches all files in and below NetworkPkg excluding NetworkPkg/Ip6Dxe/
  47. Filenames not caught by any F: rule get matched as being located in the top-
  48. level directory. (Internally, the script looks for a match called '<default>',
  49. so please don't add a file called that in the top-level directory.)
  50. EDK II Platforms
  51. ----------------
  52. W: https://github.com/tianocore/tianocore.github.io/wiki/EDK-II
  53. L: https://edk2.groups.io/g/devel/
  54. T: git - https://github.com/tianocore/edk2-platforms.git
  55. All patches CC:d here
  56. L: devel@edk2.groups.io
  57. F: *
  58. F: */
  59. EDK II Platforms maintainers
  60. ----------------------------
  61. F: *
  62. M: Leif Lindholm <leif@nuviainc.com>
  63. M: Michael D Kinney <michael.d.kinney@intel.com>
  64. Responsible Disclosure, Reporting Security Issues
  65. -------------------------------------------------
  66. W: https://github.com/tianocore/tianocore.github.io/wiki/Security
  67. EDK II Platforms Packages:
  68. --------------------------
  69. 96Boards
  70. F: Platform/96Boards/
  71. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  72. M: Leif Lindholm <leif@nuviainc.com>
  73. AMD Seattle
  74. F: Platform/AMD/OverdriveBoard/
  75. F: Platform/LeMaker/CelloBoard/
  76. F: Platform/SoftIron/
  77. F: Silicon/AMD/Styx/
  78. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  79. M: Leif Lindholm <leif@nuviainc.com>
  80. Ampere Computing
  81. F: Platform/Ampere
  82. F: Silicon/Ampere
  83. R: Nhi Pham <nhi@os.amperecomputing.com>
  84. R: Vu Nguyen <vunguyen@os.amperecomputing.com>
  85. R: Thang Nguyen <thang@os.amperecomputing.com>
  86. R: Chuong Tran <chuong@os.amperecomputing.com>
  87. M: Leif Lindholm <leif@nuviainc.com>
  88. ARM
  89. F: Platform/ARM/
  90. F: Silicon/ARM/
  91. R: Ard Biesheuvel <ardb+tianocore@kernel.org>
  92. R: Thomas Abraham <thomas.abraham@arm.com>
  93. M: Sami Mujawar <sami.mujawar@arm.com>
  94. BeagleBoard:
  95. F: Platform/BeagleBoard/
  96. F: Silicon/TexasInstruments/
  97. R: Ard Biesheuvel <ardb+tianocore@kernel.org>
  98. M: Leif Lindholm <leif@nuviainc.com>
  99. Comcast
  100. F: Platform/Comcast/
  101. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  102. M: Leif Lindholm <leif@nuviainc.com>
  103. OptionRomPkg
  104. F: Drivers/OptionRomPkg/
  105. W: https://github.com/tianocore/tianocore.github.io/wiki/OptionRomPkg
  106. M: Ray Ni <ray.ni@intel.com>
  107. StandAloneMMPkg for OP-TEE
  108. F: Platform/StandaloneMm/PlatformStandaloneMmPkg/
  109. M: Sami Mujawar <sami.mujawar@arm.com>
  110. M: Ilias Apalodimas <ilias.apalodimas@linaro.org>
  111. DisplayLink
  112. F: Drivers/DisplayLink/
  113. M: Leif Lindholm <leif@nuviainc.com>
  114. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  115. R: Andy Hayes <andy.hayes@displaylink.com>
  116. HiSilicon
  117. F: Platform/Hisilicon/
  118. F: Silicon/Hisilicon/
  119. M: Leif Lindholm <leif@nuviainc.com>
  120. R: Ard Biesheuvel <ardb+tianocore@kernel.org>
  121. R: Wenyi Xie <xiewenyi2@huawei.com>
  122. Features/Ext4Pkg
  123. F: Features/Ext4Pkg/
  124. M: Pedro Falcato <pedro.falcato@gmail.com>
  125. Features/Intel
  126. F: Features/Intel/
  127. M: Sai Chaganty <rangasai.v.chaganty@intel.com>
  128. R: Liming Gao <gaoliming@byosoft.com.cn>
  129. Features/Intel/Debugging
  130. F: Features/Intel/Debugging/
  131. M: Eric Dong <eric.dong@intel.com>
  132. R: Liming Gao <gaoliming@byosoft.com.cn>
  133. Features/Intel/OutOfBandManagement/IpmiFeaturePkg
  134. F: Features/Intel/OutOfBandManagement/IpmiFeaturePkg
  135. M: Isaac Oram <isaac.w.oram@intel.com>
  136. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  137. R: Liming Gao <gaoliming@byosoft.com.cn>
  138. Features/Intel/UserInterface
  139. F: Features/Intel/UserInterface/
  140. M: Dandan Bi <dandan.bi@intel.com>
  141. R: Liming Gao <gaoliming@byosoft.com.cn>
  142. Platform/Intel/QuarkPlatformPkg
  143. F: Platform/Intel/QuarkPlatformPkg/
  144. M: Michael D Kinney <michael.d.kinney@intel.com>
  145. M: Kelly Steele <kelly.steele@intel.com>
  146. R: Nate DeSimone <nathaniel.l.desimone@intel.com>
  147. Platform/Intel/Vlv2TbltDevicePkg
  148. F: Platform/Intel/Vlv2TbltDevicePkg/
  149. M: Zailiang Sun <zailiang.sun@intel.com>
  150. M: Yi Qian <yi.qian@intel.com>
  151. R: Nate DeSimone <nathaniel.l.desimone@intel.com>
  152. Platform/Intel/BoardModulePkg
  153. F: Platform/Intel/BoardModulePkg/
  154. M: Eric Dong <eric.dong@intel.com>
  155. R: Liming Gao <gaoliming@byosoft.com.cn>
  156. Platform/Intel/KabylakeOpenBoardPkg
  157. F: Platform/Intel/KabylakeOpenBoardPkg/
  158. M: Chasel Chiu <chasel.chiu@intel.com>
  159. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  160. Platform/Intel/KabylakeOpenBoardPkg/AspireVn7Dash572G
  161. F: Platform/Intel/KabylakeOpenBoardPkg/AspireVn7Dash572G/
  162. R: Benjamin Doron <benjamin.doron00@gmail.com>
  163. Platform/Intel/KabylakeOpenBoardPkg/GalagoPro3
  164. F: Platform/Intel/KabylakeOpenBoardPkg/GalagoPro3/
  165. R: Jeremy Soller <jeremy@system76.com>
  166. Platform/Intel/MinPlatformPkg
  167. F: Platform/Intel/MinPlatformPkg/
  168. M: Chasel Chiu <chasel.chiu@intel.com>
  169. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  170. R: Liming Gao <gaoliming@byosoft.com.cn>
  171. R: Eric Dong <eric.dong@intel.com>
  172. Platform/Intel/PurleyOpenBoardPkg
  173. F: Platform/Intel/PurleyOpenBoardPkg/
  174. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  175. M: Chasel Chiu <chasel.chiu@intel.com>
  176. Platform/Intel/WhiskeylakeOpenBoardPkg
  177. F: Platform/Intel/WhiskeylakeOpenBoardPkg/
  178. M: Chasel Chiu <chasel.chiu@intel.com>
  179. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  180. Platform/Intel/CometlakeOpenBoardPkg
  181. F: Platform/Intel/CometlakeOpenBoardPkg/
  182. M: Chasel Chiu <chasel.chiu@intel.com>
  183. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  184. M: Rangasai V Chaganty <rangasai.v.chaganty@intel.com>
  185. R: Deepika Kethi Reddy <deepika.kethi.reddy@intel.com>
  186. R: Kathappan Esakkithevar <kathappan.esakkithevar@intel.com>
  187. Platform/Intel/TigerlakeOpenBoardPkg
  188. F: Platform/Intel/TigerlakeOpenBoardPkg/
  189. M: Sai Chaganty <rangasai.v.chaganty@intel.com>
  190. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  191. R: Heng Luo <heng.luo@intel.com>
  192. Platform/Intel/WhitleyOpenBoardPkg
  193. F: Platform/Intel/WhitleyOpenBoardPkg/
  194. M: Isaac Oram <isaac.w.oram@intel.com>
  195. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  196. M: Chasel Chiu <chasel.chiu@intel.com>
  197. Platform/Intel/SimicsOpenBoardPkg
  198. F: Platform/Intel/SimicsOpenBoardPkg/
  199. M: Agyeman Prince <prince.agyeman@intel.com>
  200. Platform/Intel/Tools
  201. F: Platform/Intel/Tools/
  202. M: Bob Feng <bob.c.feng@intel.com>
  203. M: Liming Gao <gaoliming@byosoft.com.cn>
  204. R: Yuwei Chen <yuwei.chen@intel.com>
  205. Platform/RISC-V/PlatformPkg
  206. F: Platform/RISC-V/PlatformPkg/
  207. M: Abner Chang <abner.chang@hpe.com>
  208. R: Daniel Schaefer <daniel.schaefer@hpe.com>
  209. R: Gilbert Chen <gilbert.chen@hpe.com>
  210. Platform/SiFive/U5Series
  211. F:Platform/SiFive/U5Series/
  212. M: Abner Chang <abner.chang@hpe.com>
  213. R: Gilbert Chen <gilbert.chen@hpe.com>
  214. R: Daniel Schaefer <daniel.schaefer@hpe.com>
  215. Silicon/Intel/IntelSiliconPkg
  216. F: Silicon/Intel/IntelSiliconPkg/
  217. M: Ray Ni <ray.ni@intel.com>
  218. M: Rangasai V Chaganty <rangasai.v.chaganty@intel.com>
  219. Silicon/Intel/QuarkSocPkg
  220. F: Silicon/Intel/QuarkSocPkg/
  221. M: Michael D Kinney <michael.d.kinney@intel.com>
  222. M: Kelly Steele <kelly.steele@intel.com>
  223. R: Nate DeSimone <nathaniel.l.desimone@intel.com>
  224. Silicon/Intel/Vlv2DeviceRefCodePkg
  225. F: Silicon/Intel/Vlv2DeviceRefCodePkg/
  226. M: Zailiang Sun <zailiang.sun@intel.com>
  227. M: Yi Qian <yi.qian@intel.com>
  228. R: Nate DeSimone <nathaniel.l.desimone@intel.com>
  229. Silicon/Intel/CoffeelakeSiliconPkg
  230. F: Silicon/Intel/CoffeelakeSiliconPkg/
  231. M: Chasel Chiu <chasel.chiu@intel.com>
  232. M: Sai Chaganty <rangasai.v.chaganty@intel.com>
  233. Silicon/Intel/KabylakeSiliconPkg
  234. F: Silicon/Intel/KabylakeSiliconPkg/
  235. M: Chasel Chiu <chasel.chiu@intel.com>
  236. M: Sai Chaganty <rangasai.v.chaganty@intel.com>
  237. Silicon/Intel/PurleyRefreshSiliconPkg
  238. F: Silicon/Intel/PurleyRefreshSiliconPkg/
  239. M: Chasel Chiu <chasel.chiu@intel.com>
  240. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  241. Silicon/Intel/TigerlakeSiliconPkg
  242. F: Silicon/Intel/TigerlakeSiliconPkg/
  243. M: Sai Chaganty <rangasai.v.chaganty@intel.com>
  244. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  245. R: Heng Luo <heng.luo@intel.com>
  246. Silicon/Intel/WhitleySiliconPkg
  247. F: Silicon/Intel/WhitleySiliconPkg/
  248. M: Isaac Oram <isaac.w.oram@intel.com>
  249. M: Nate DeSimone <nathaniel.l.desimone@intel.com>
  250. M: Chasel Chiu <chasel.chiu@intel.com>
  251. Silicon/Intel/SimicsX58SktPkg
  252. F: Silicon/Intel/SimicsX58SktPkg/
  253. M: Agyeman Prince <prince.agyeman@intel.com>
  254. Silicon/Intel/SimicsIch10Pkg
  255. F: Silicon/Intel/SimicsIch10Pkg/
  256. M: Agyeman Prince <prince.agyeman@intel.com>
  257. Silicon/Intel/Tools
  258. F: Silicon/Intel/Tools/
  259. M: Bob Feng <bob.c.feng@intel.com>
  260. M: Liming Gao <gaoliming@byosoft.com.cn>
  261. R: Yuwei Chen <yuwei.chen@intel.com>
  262. Marvell platforms and silicon
  263. F: Platform/Marvell/
  264. F: Platform/SolidRun/Armada80x0McBin/
  265. F: Silicon/Marvell/
  266. R: Marcin Wojtas <mw@semihalf.com>
  267. M: Leif Lindholm <leif@nuviainc.com>
  268. Miscellaneous drivers
  269. F: Silicon/Atmel/
  270. F: Silicon/Openmoko/
  271. F: Silicon/Synopsys/DesignWare/
  272. R: Ard Biesheuvel <ardb+tianocore@kernel.org>
  273. M: Leif Lindholm <leif@nuviainc.com>
  274. NXP platforms and silicon
  275. F: Platform/NXP/
  276. F: Silicon/NXP/
  277. M: Leif Lindholm <leif@nuviainc.com>
  278. R: Meenakshi Aggarwal <meenakshi.aggarwal@nxp.com>
  279. QEMU sbsa-ref platform
  280. F: Platform/Qemu/SbsaQemu/
  281. F: Silicon/Qemu/SbsaQemu/
  282. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  283. M: Leif Lindholm <leif@nuviainc.com>
  284. R: Graeme Gregory <graeme@nuviainc.com>
  285. R: Radoslaw Biernacki <rad@semihalf.com>
  286. Raspberry Pi platforms and silicon
  287. F: Platform/RaspberryPi/
  288. F: Silicon/Broadcom/
  289. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  290. M: Leif Lindholm <leif@nuviainc.com>
  291. R: Pete Batard <pete@akeo.ie>
  292. RPMB driver for OP-TEE
  293. F: Drivers/OpTee/OpteeRpmbPkg/
  294. M: Sami Mujawar <sami.mujawar@arm.com>
  295. M: Ilias Apalodimas <ilias.apalodimas@linaro.org>
  296. Socionext platforms and silicon
  297. F: Platform/Socionext/
  298. F: Silicon/NXP/Library/Pcf8563RealTimeClockLib/
  299. F: Silicon/Socionext/
  300. M: Ard Biesheuvel <ardb+tianocore@kernel.org>
  301. M: Leif Lindholm <leif@nuviainc.com>
  302. Silicon/RISC-V/ProcessorPkg
  303. F: Silicon/RISC-V/ProcessorPkg/
  304. M: Abner Chang <abner.chang@hpe.com>
  305. M: Daniel Schaefer <daniel.schaefer@hpe.com>
  306. R: Gilbert Chen <gilbert.chen@hpe.com>
  307. Silicon/SiFive
  308. F: Silicon/SiFive/
  309. M: Abner Chang <abner.chang@hpe.com>
  310. M: Gilbert Chen <gilbert.chen@hpe.com>
  311. R: Daniel Schaefer <daniel.schaefer@hpe.com>
  312. Phytium platforms and silicon
  313. F: Platform/Phytium/
  314. F: Silicon/silicon/
  315. M: Leif Lindholm <leif@nuviainc.com>
  316. R: Peng Xie <xiepeng@phytium.com.cn>
  317. R: Ling Jia <jialing@phytium.com.cn>
  318. R: Yiqi Shu <shuyiqi@phytium.com.cn>