Kconfig 2.9 KB

123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051525354555657585960616263646566676869707172737475767778
  1. config CMD_STBOARD
  2. bool "stboard - command for OTP board information"
  3. depends on ARCH_STM32MP
  4. default y if TARGET_ST_STM32MP15x
  5. help
  6. This compile the stboard command to
  7. read and write the board in the OTP.
  8. config MTDPARTS_NAND0_BOOT
  9. string "mtd boot partitions for nand0"
  10. default "2m(fsbl),2m(ssbl1),2m(ssbl2)"
  11. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  12. help
  13. This define the partitions of nand0 used to build mtparts dynamically
  14. for boot from nand0.
  15. Each partition need to be aligned with the device erase block size,
  16. 512KB is the max size for the NAND supported by stm32mp1 platform.
  17. config MTDPARTS_NAND0_TEE
  18. string "mtd tee partitions for nand0"
  19. default "512k(teeh),512k(teed),512k(teex)"
  20. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  21. help
  22. This define the tee partitions added in mtparts dynamically
  23. when tee is supported with boot from nand0.
  24. Each partition need to be aligned with the device erase block size,
  25. 512KB is the max size for the NAND supported by stm32mp1 platform.
  26. config MTDPARTS_NOR0_BOOT
  27. string "mtd boot partitions for nor0"
  28. default "256k(fsbl1),256k(fsbl2),2m(ssbl),512k(u-boot-env)"
  29. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  30. help
  31. This define the partitions of nand0 used to build mtparts dynamically
  32. for boot from nor0.
  33. Each partition need to be aligned with the device erase block size,
  34. with 256KB we support all the NOR.
  35. U-Boot env partition (512kB) use 2 erase block for redundancy.
  36. config MTDPARTS_NOR0_TEE
  37. string "mtd tee partitions for nor0"
  38. default "256k(teeh),512k(teed),256k(teex)"
  39. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  40. help
  41. This define the tee partitions added in mtparts dynamically
  42. when tee is supported with boot from nor0.
  43. config MTDPARTS_SPINAND0_BOOT
  44. string "mtd boot partitions for spi-nand0"
  45. default "2m(fsbl),2m(ssbl1),2m(ssbl2)"
  46. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  47. help
  48. This define the partitions of nand0 used to build mtparts dynamically
  49. for boot from spi-nand0,
  50. 512KB is the max size for the NAND supported by stm32mp1 platform.
  51. config MTDPARTS_SPINAND0_TEE
  52. string "mtd tee partitions for spi-nand0"
  53. default "512k(teeh),512k(teed),512k(teex)"
  54. depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
  55. help
  56. This define the tee partitions added in mtparts dynamically
  57. when tee is supported with boot from spi-nand0,
  58. 512KB is the max size for the NAND supported by stm32mp1 platform.
  59. config DFU_ALT_RAM0
  60. string "dfu for ram0"
  61. default "uImage ram 0xc2000000 0x2000000;devicetree.dtb ram 0xc4000000 0x100000;uramdisk.image.gz ram 0xc4400000 0x10000000"
  62. depends on ARCH_STM32MP && SET_DFU_ALT_INFO
  63. help
  64. This defines the partitions of ram used to build dfu dynamically.
  65. config TYPEC_STUSB160X
  66. tristate "STMicroelectronics STUSB160X Type-C controller driver"
  67. depends on DM_I2C
  68. help
  69. Say Y if your system has STMicroelectronics STUSB160X Type-C port
  70. controller.